Dr. Chiu is the CEO and Chairman for Winbond Electronics Corporation (WECA). He served as the President of WECA from 2000 to 2007. He has more than 30 years experience in the semiconductor industry and more than 25 years management experience. Dr. Chiu joined Winbond in 1995 as Assistant Vice President of Technology Development for Winbond Electronics Corporation (WEC) in Taiwan. In 1997, he was assigned by WEC as the President of a Winbond investment start up company, WSMC. In 1998, he became the Vice President of Technology Development for WEC, with responsibility for overseeing all technology and research and development programs for the Company. In 1999, Dr. Chiu became the Corporation's Executive Vice President and General Manager of the DRAM Business Group, overseeing that groups' manufacturing, R&D and marketing efforts. He was promoted as the President of WECA in 2000. From 2000 to 2005, in addition to his responsibilities of running the U.S.-based WECA operation, Dr. Chiu was also an executive vice president for WEC and the Chairman of the Board for NexFlash Corporation which was a U.S.-based company designing and marketing specialty flash memory ICs. Prior to joining Winbond, Dr. Chiu worked for 15 years at Hewlett Packard Corporation where he held a variety of management positions. Earlier in his career, he was also on the technical staff at Northrop Corporation.

Dr. Chiu obtained his doctorate degree, a Ph.D. in Materials Science at the University of Southern California, U.S.A. He earned a Masters of Science Degree in Electronics from the National Chiao Tung University, Taiwan and a Bachelor of Science Degree in Electrical Engineering from the National Cheng Kung University, Taiwan. Dr. Chiu holds 12 patents in semiconductor design and technology and has authored more than 80 industry and technical papers. He has served as a technical committee member for the International Electron Devices Meetings (IEDM), the VLSI Technology Symposium, and as Chairman of the IEEE Electron Devices Society of Silicon Valley Chapter.

 

Mr. Park is the President for Winbond Electronics Corporation America (WECA). He has 25 years of engineering expertise in semiconductor products and high technology systems and more than 18 years management experience. In 2002, Mr. Park joined NexFlash Technologies as the company's Executive Vice President of Engineering, specializing in serial flash design and production. In March of 2005, NexFlash Technologies was acquired by Winbond and integrated into the WECA organization. Mr. Park was subsequently appointed to Executive Vice President, Serial Flash Product Center and later promoted to the President for Winbond Electronics Corporation America (WECA). Prior to this, Mr. Park worked for four years at Azalea Microelectronics where he was most recently that company's Vice President of Engineering. Prior to working at Azalea Microelectronics, he worked as the Design Director at NVM group at ISSI/Nexflash.

Mr. Park received his BSEE/MSEE from University of California at Berkeley. He currently holds over 20 U.S. patents in Non-volatile memories.

Mr. Jigour is Vice President of Marketing for the Flash Product Center at Windbond Electronics Corporation of America (WECA). He has worked in the semiconductor industry for over thirty years with positions at Intel, Exel, ICT, Nexcom, ISSI and NexFlash. For more than half of his career he has held Director or VP-level management positions in marketing and applications. In 1995, Mr. Jigour pioneered the first Serial Flash memories into the market as part of the Nexcom / NexFlash team. He joined WECA in 2005 when Winbond acquired NexFlash. With considerable experience in programmable logic and non-volatile memories, Mr. Jigour has authored over 100 articles, conference papers and product publications; holds seven patents related to programmable devices; and defined Winbond’s groundbreaking Dual and Quad SpiFlash memory products, which have established Winbond as the industry leader in high-performance Serial Flash. As Vice President of Marketing for Winbond’s Flash product center, Mr. Jigour is responsible for all Flash product marketing activities and customer marketing activities in North America, Europe, Japan, Korea, Singapore, and other emerging markets.

 

Mr. Su is the Vice President DRAM Design for Winbond Electronics Corporation America (WECA). He has more than 25 years of engineering and management expertise in semiconductor industry. In 2007, he joined WECA as Vice President with responsibility of the development of DRAM products. Prior to joining WECA, he worked for Sun microsystems, Integrated Silicon Solution Incorporation, Hyundai Electronics America, Samsung Semiconductor, HMC and National Semiconductor.

He received his BSEE degree from National Cheng Kung University, Taiwan, and MSEE degrees from National Taiwan University, Taiwan and University of Maryland, respectively. He currently holds three US patents in memory design.