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spiFlash Serial Flash Memory Overview

NexFlash Company Contact:
Robin Jigour
Vice President of Marketing
408-544-2672 Phone
408-544-2645 Fax
robin_jigour@nexflash.com

Editorial Contact:
CommonGround Communications
(for NexFlash)

Jerry Steach
415-222-9996 Phone
jsteach@pacbell.net

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NEXFLASH DEBUTS BROAD LINE OF FLASH MEMORIES WITH SERIAL PERIPHERAL INTERFACE

  • New spiFlash® Memories Designed for Serial Code-Storage Applications.
  • Feature Fastest Clock Rates, Wide Density Range, Space-Saving Packages.

SAN JOSE, CA. - September. 15, 2003
NexFlash Technologies, Inc., a pioneer in Serial Flash technology, today introduced NexFlash® spiFlash® Serial Flash Memories, a line of Flash memory devices featuring the popular Serial Peripheral Interface (SPI), densities from 1M-bit to 32M-bit and performance and packaging tailored for emerging serial code-storage applications. The first members of the spiFlash line, introduced today, are the NX25P10 (1Mb), NX25P20 (2Mb) and NX25P40 (4Mb).

Using an advanced 0.18-micron technology from NexFlash's partner Winbond Electronics Corp., the spiFlash family comprises the first full line of Serial Flash memories to offer 33MHz speeds across all densities. Space-saving packaging and other features make spiFlash memories ideal for a broad range of serial code-storage applications such as hard disk drives, printers, graphics, ADSL and cable modem, wireless LANs, DVDs, and industrial and automotive products. The spiFlash line can also be used for data, text and voice storage in most microcontroller-based systems.

"When NexFlash pioneered the Serial Flash market years ago, the applications were principally data-storage," said Robin Jigour, vice president of marketing at NexFlash. "Today, however, many systems are simply downloading code from Flash into faster system RAM and consequently Serial Flash has emerged as a viable alternative to Parallel Flash for code-storage.

"Since Parallel Flash requires a 28- to 44-pin interface, the overhead is significant. Switching to the 4-pin interface of spiFlash memories greatly reduces ASIC controller pin count, board space, power, system noise and overall cost. Additionally, the line's combination of high speed, density range and common footprint packaging provide designers with a wide array of options to meet evolving system requirements."

High Growth Market
The market for Serial Flash memories continues to show significant growth. "With increasing densities and smaller footprints, we see the Serial Flash market positively affected by an expanding array of applications that can utilize devices like NexFlash's spiFlash line," said Alan Niebel at Web-Feet Research. "Web-Feet projects sequential annual growth for Serial Flash between 40% to 60% over the next several years, from $234M in 2002 to more than $750M in 2005, with SPI-type Serial Flash making up about one half of the market "

SPI, Programmability, Power, Packaging
Like all spiFlash devices, the NX25P10, NX25P20 and NX25P40 feature a 4-pin (clock, chip select, data in, data out) SPI port that is popular with microcontrollers and ASIC designs. Optional write-protect and hold pins are also provided. Data can be sequentially read at 33MHz (compared to 20 or 25 MHz for other Serial Flash) allowing a code-download rate of 1M-bit per 31mS. Device architecture is organized in multiple pages of 256 bytes per page with typical page program time of 2ms. Each spiFlash device operates on a single 2.7V to 3.6V supply and features low-power consumption of 4mA read, 15mA erase/program and typical power-down standby of 1 microamp. spiFlash devices are housed in small 8-pin 150mil (6x5mm) SOIC packages and optional MLP packages that have the same basic foot print as the SOIC with a height that is 40% thinner. Both use less than 25% the space of Parallel Flash packages. The MLP package also allows a migration path to higher density spiFlash devices. Standard spiFlash devices are specified for -40 to +85C (industrial) operating temperature.

Availability
Samples of the NX25P10 (1Mb) and NX25P20 (2Mb) are available in September with production in November. Samples of the NX25P40 (4Mb) are available in November, with production by the end of the year. Higher densities in the spiFlash family are scheduled for introduction in Q1 2004.

About NexFlash
NexFlash Technologies, Inc. designs and markets Specialty Flash Memory Products for emerging applications. NexFlash was founded in October 1998 and is a partially owned subsidiary of Winbond Electronics Corporation. NexFlash holds numerous patents on its technology and has established strategic alliances with Sharp Corporation and Winbond Electronics Corporation. For more information please visit the NexFlash website at www.nexflash.com

NexFlash® and spiFlash® are trademarks of NexFlash Technologies., which may be registered in some jurisdictions. All other product names that appear in this material are for identification purposes only and are acknowledged to be trademarks or registered trademarks of their respective companies.

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