From 2000 to 2006, Dr. Kuang-Yi Chiu was the President of Winbond Electronics Corporation America (WECA). He has more than 28 years experience in the semiconductor industry and more than 18 years management experience. Dr. Chiu joined Winbond in 1995 as Assistant Vice President of Technology Development for Winbond Electronics Corporation (WEC). In 1997, he was assigned by WEC as the President of a Winbond investment start up company, WSMC. In 1998, he became the Vice President of Technology Development for WEC, with responsibility for overseeing all technology and research and development programs for the Company. In 1999, Dr. Chiu became the Corporation's Executive Vice President and General Manager of the DRAM Business Group, overseeing that groups' manufacturing, R&D and marketing efforts. He was promoted to his current position of President of WECA in 2000. In addition to his current responsibilities of running the U.S.-based WECA operation, Dr. Chiu is also an executive vice president for WEC and the Chairman of the Board for NexFlash Corporation. Winbond owns a majority stake in NexFlash, which is a U.S.-based company designing and marketing specialty flash memory ICs. Prior to joining Winbond, Dr. Chiu worked for 15 years at Hewlett Packard Corporation where he held a variety of management positions. Earlier in his career, he was also on the technical staff at Northrop Corporation.

Dr. Chiu obtained his doctorate degree, a Ph.D. in Materials Science at the University of Southern California, U.S.A. He earned a Masters of Science Degree in Electronics from the National Chiao Tung University, Taiwan and a Bachelor of Science Degree in Electrical Engineering from the National Cheng Kung University, Taiwan. Dr. Chiu holds 12 patents in semiconductor design and technology and has authored more than 80 industry and technical papers. He has served as a technical committee member for the International Electron Devices Meetings (IEDM), the VLSI Technology Symposium, and as Chairman of the IEEE Electron Devices Society of Silicon Valley Chapter.

 

Mr. Chu is the President of Winbond Electronics Corporation America. He has more than 25 years of technology expertise and more than 16 years of management experience in the semiconductor and high tech industries. Since joining Winbond in 1994, he has held various management positions including Vice President of Strategy Planning, Director of Marketing, and Vice President of General and Administration. Prior to joining Winbond, he worked for Hewlett Packard in various technical and managerial roles including as a Development Engineer, Project Manager, and Program Manager for that Company's Personal Computer and NetServer Product Divisions. He also held the position of Executive Vice President for Symphony Laboratories.

Mr. Chu received his Masters of Science degree in Electrical/Computer Engineering and Bachelor of Science degree in Electrical Engineering from the University of California at Davis. He is a member of IEEE and the author of numerous technical papers.

 

Mr. Awsare is the Executive Vice President of Mixed Signal group, for Winbond Electronics Corporation America (WECA). He has more than 15 years of engineering expertise in semiconductor products and high technology systems and more than 10 years management experience. In 1997, Mr. Awsare joined Information Storage Devices (ISD) as the Company's Director of Design Engineering. In December of 1998, ISD was acquired by Winbond and integrated into the WECA organization. Mr. Awsare was subsequently promoted to Senior Director of Engineering and, in 2001, promoted to his current position of Vice President, Mixed Signal Product Center for WECA. Prior to this, Mr. Awsare worked for eight years at the EXEL Microelectronics where he was most recently that company's Director of EEPROM Products. Prior to working at EXEL, he worked as an engineer in the design department at Exar Corporation.

Mr. Awsare received his B.S.E.E from the Stevens Institute of Technology in New Jersey, U.S. A. He earned his Masters in Engineering and Management from the University of Santa Clara, Santa Clara, California, U.S.A. He is the author of more than 15 technical industry papers and currently holds three patents in semiconductor design and technology.

Mr. Park is the Executive Vice President, Serial Flash Product Center, for Winbond Electronics Corporation America (WECA). He has more than 22 years of engineering expertise in semiconductor products and high technology systems and more than 18 years management experience. In 2002, Mr. Park joined NexFlash Technologies as the company's Executive Vice President of Engineering, specializing in serial flash design and production. In March of 2005, NexFlash Technologies was acquired by Winbond and integrated into the WECA organization. Mr. Park was subsequently appointed to his current title of Executive Vice President, Serial Flash Product Center for Winbond Electronics Corporation America (WECA). Prior to this, Mr. Park worked for four years at Azalea Microelectronics where he was most recently that company's Vice President of Engineering. Prior to working at Azalea Microelectronics, he worked as the Design Director at NVM group at ISSI/Nexflash.

Mr. Park received his BSEE/MSEE from University of California at Berkeley. He currently holds over 20 U.S.
patents in Non-volatile memories.

Mr. Tao received a Masters degree in Electrical Engineering from California State University, Long Beach, USA. He has 28 years of professional and managerial experience in the IC field. He has worked with WECA since 2003 serving as Strategic Marketing Executive. Prior to joining WECA, he served as CEO of Finesse Wireless, Senior Director and General Manager of National Semiconductor, Senior Manager of Rockwell international, Founder of Ecco Industries, and Manager in Sharp Corporation.

 

Mr. Saeed has over 26 years of experience in product marketing and semiconductors design and applications engineering. Prior to joining Winbond Electronics America Corp. in 2006, Mr. Saeed served as Vice President of Marketing at Oki Semiconductors for over 6 years.   Mr. Saeed spent over 16 years at Mitsubishi Electronics America (now Renesas Technology Corp.) in various management positions in their Embedded Controllers and ASIC division, most recently as Director of Application Specific Standard Products group. He also worked at Advanced Micro Device for 3 years in product planning and design of LAN and networking products. Mr. Saeed has a MSEE degree from University of Tennessee in Knoxville, USA.