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WPCD376I Desktop Super I/O with Glue Functions/® Vista™ MC Compliant

The Winbond WPCD376I is a member of the Winbond SuperI/O family. It is a legacy-reduced SuperI/O solution based on the WPCD374L product. In addition to basic SuperI/O functionality it include the system glue functions, a Microsoft® Windows® Vista™ Media Center (MC) compliant consumer infrared module, commonly used functions such as GPIOs, and ACPI-compliant Power Management support.

The WPCD376I integrates a Consumer Infrared (CIR) module that supports remote control capabilities, IR learning, IR emitting and System Wake-Up optimized for new generation entertainment PCs running Vista operating system. It eliminates the need for external CIR devices thus providing a simplified and reduced-cost solution.

The WPCD376I integrates miscellaneous analog and digital system glue functions to reduce the number of discrete components required. The host communicates with the functions integrated in the WPCD376I device through an LPC Bus Interface.

The WPCD376I enhanced wake-up support complements the ACPI controller in the chipset. The System Wake-Up Control (SWC) module, powered by VSB3, supports a flexible wake-up mechanism.

The WPCD376I supports both I/O and memory mapping of module registers, and enables building legacy-free systems.

For more detailed technical information about Winbond's embedded controllers for notebook applications, click here to Contact Sales.

 
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Key Features
  • Vista MC compliant Consumer Infrared functionality
    • Supports all IR protocols required to be compliant with Windows Vista MC receive and transmit requirements
    • IR Wake up capability from various sleep states
    • Four infrared emitting channels (IR blasters)
    • Supports IR learning
  • Glue functions to complement the South Bridge functionality identical to the PC8374L Glue
  • Pin and software compliance with the existing PC8374L features
  • VSB3-powered Power Management with 19 wake-up sources
  • 16 GPIO ports with a variety of wake-up options
  • Legacy-reduced set of SuperI/O modules; one serial port and SIR removed
  • LPC interface, based on Intel's LPC Interface Specification Revision 1.1, August 2002
  • PC2001 Revision 1.0 and Advanced Configuration and Power Interface (ACPI) Specification Revision 3.0 compliant