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WPCD374L Super I/O with Glue Functions/Fan Control |
WPCD374L integration allows for a smaller system board size and saves on total system cost.
The WPCD374L includes legacy Super I/O functions, system glue functions, health monitoring and control, commonly used functions such as GPIO, and ACPI-compliant Power Management support.
The WPCD374L integrates miscellaneous analog and digital system glue functions to reduce the number of discrete components required. The host communicates with the functions integrated in the WPCD374L device through an LPC Bus Interface.
The WPCD374L extended wake-up support complements the ACPI controller in the chipset. The System Wake-Up Control (SWC) module, powered by VSB3, supports a flexible wake-up mechanism.
The WPCD374L supports both I/O and memory mapping of module registers and enables building legacy-free systems.
For more detailed technical information about Winbond's embedded controllers for notebook applications, click here to Contact
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- SensorPath™ interface to LMxx sensor devices for system health support
- Fan monitor and control
- Heceta6-compatible register set, accessible via the LPC interface and SMBus
- Glue functions to complement the South Bridge functionality
- VSB3-powered Power Management with 19 wake-up sources
- Controls three LED indicators
- 16 GPIO ports with a variety of wake-up options
- I/O-mapped and memory-mapped registers
- Legacy modules: Parallel Port, Floppy Disk Controller (FDC), two Serial Ports, Slow InfraRed Port and a Keyboard and Mouse Controller (KBC)
- LPC interface, based on Intel's LPC Interface Specification Revision 1.1, August 2002
- Fully compatible with Winbond's 8374L (formerly known as PC8374L)
- PC01 Revision 1.0 and Advanced Configuration and Power Interface (ACPI) Specification Revision 2.0 compliant
- 128-pin PQFP package
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