Winbond’s family of highly integrated WPCD37xx Super I/O devices are pin- and software-compatible, thus providing drop-in interchangeability and enabling a variety of assembly options using only a single motherboard and BIOS. WPCD37xx integration allows for a smaller system board size and saves on total system cost. The WPCD374x family includes legacy Super I/O functions, system glue functions, health monitoring and control, commonly used functions such as GPIO, and ACPI-compliant Power Management support. The WPCD37xx family integrates miscellaneous analog and digital system glue functions to reduce the number of discrete components required. The host communicates with the functions integrated in the WPCD37xx devices through an LPC Bus Interface.

Extended wake-up support complements the ACPI controller in the chipset. The System Wake-Up Control (SWC) module, powered by VSB3, supports a flexible wakeup mechanism. Trusted I/O versions include a Trusted Platform Module (TPM) that provides a complete hardware, software and firmware solution for PC security, based on TCG standards.

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WPCD374L

Desktop Super I/O with Glue Functions, Health Management and three Fan Controls and Monitors,
pin and software-compatible with Winbond's 8374L (formerly known as PC8374L)

128 PQFP

WPCD376I

Desktop Super I/O with Glue Functions and ® Vista™ Media Center (MC) compliant Consumer Infrared support. It is software-compatible with WPCD374L

128 PQFP