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spiFlash® Family Ordering Information |
Company Prefix
NX = NexFlash
W = Winbond
Product Family
25P = spiFlash Memory, 64KB uniform sectors
25B = spiFlash Memory, Boot Sectors.
25X = spiFlash Memory, 4KB sectors, 64KB blocks
Product Number / Density
10 = 1M-bit
20 = 2M-bit
40 = 4M-bit
80 = 8M-bit
16 = 16M-bit
32 = 32M-bit
64 = 64M-bit
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Supply Voltage
V = 2.7 to 3.6 Volt
Package Type
SN = 8-pin SOIC 150mil
SS = 8-pin SOIC 208mil
SF = 16-pin SOIC 300mil
ZP = 8-contact WSON 6x5mm *
ZE = 8-contact WSON 8x6mm *
* Contact Winbond for availability of this package.
Temperature Range
I = Industrial (–40°C to +85°C)
Special Options
(Blank) = Standard
G = Green Package (Lead-Free, RoHS compliant)
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The SpiFlash® 25P and 25X families include products ranging
in densities from 1M-bit to 64M-bit. Features include:
- Standard 4-pin Serial Peripheral Interface (SPI)
- Clocking operation up to 50MHz (25P), 75MHz (25X), 150MHz (25X Dual Output)
- 3 volt (2.7 to 3.6) power supply
- 1µA power down standby
- 4KB erasable sectors (25X), 64KB blocks (25P & 25X)
- Page program up to 256 bytes/2mS
- Electronic ID
- -40° to +85°C operating range
- Space saving packages
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