Product Lines
Parallel Flash

Winbond industry-standard Flash memories offer an extensive line of 3.3V products from 512Kb to 4Mb, 3V products from 32Mb, and 5V products from 512Kb to 4Mb densities. Our products feature Boot and Uniform Sector architectures in x8, x16 and x8/x16 selectable configurations. Winbond Flash memory provides customers with cost-effective, high performance and reliable products that offer low-power consumption and 20-year data retention.  Winbond Flash memories are ideal for a wide variety of applications including: Desktop PC, Notebook PC, Server, PC Peripherals, DVB, xDSL / wireless router, printer, PHS and more.

  
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Parallel Flash

Part Nunber
Density
Vcc
Remark
Organization
Description
Package
ROHS
Datasheet
W39V080FA
8M
3.3V
FWH
1M x 8
  • Single 3.3-volt operations
  • Fast Read access time:Tkq 11ns
  • Endurance: 30K cycles (typ) 
  • 16 Even sectors with 64K bytes 
  • Hardware protection: 64K byte Top Boot Block with lockout protection/ #TBL & #WP supports the whole chip except Boot Block hardware protection
  • Automatic program and erase timing with internal VPP operation
  • Acceleration (ACC) function accelerates program timing
  • twenty-year data retentions
  • TTL compatible I/O
  • End of program or erase detection
PLCC 32,

Y
STSOP 32
W39V080A
8M
3.3V
LCP
1M x 8
  • Single 3.3-volt operations
  • Fast Read access time:Tkq 11ns
  • Endurance: 30K cycles (typ) 
  • 16 Even sectors with 64K bytes
  • Hardware protection: 64K byte Top Boot Block with lockout protection/ #TBL & #WP supports the whole chip except Boot Block hardware protection
  • Automatic program and erase timing with internal VPP operation
  • Acceleration (ACC) function accelerates program timing
  • twenty-year data retentions
  • TTL compatible I/O
  • End of program or erase detection
PLCC 32,

Y
STSOP 32
W19B160B
16M
3.3V
Single Bank
2M x 8
  • Manufactured on WinStack-S 0.13um process technology
  • Operating Voltage: 3.0V (2.7V-3.6V)
  • Organization: 2Mbx8 / 1Mbx16
  • Speed: 70ns
  • Single bank
  • Boot Block: Top / Bottom
  • Secured Silicon Sector (256 Byte)
TSOP48

Y
1M x 16
TFBGA48
W19B320A
32M
3.3V
Flexible Bank
4M x 8
  • Manufactured on WinStack-S 0.18um process technology
  • Operating Voltage: 3.0V (2.7V-3.6V)
  • Organization: 4Mbx8 / 2Mbx16
  • Speed: 70ns
  • Simultaneous Read/Write (Flexible bank) 
  • Boot Block: Top & Bottom
  • Versatile I/O: 1.65 ~ 1.95 Volt
  • Flex Bank: 4Mb / 12 Mb / 12Mb / 4Mb
    • Bank1: 8x8KB/4Kw+7x64KB/32Kw
    • Bank2: 24x64KB/32Kw
    • Bank3: 24x64KB/32Kw
    • Bank4: 8x64KB/Kw
  • Secured Silicon Sector (256 Byte)
  • Available packages: 48-pin TSOP and 48-ball TFBGA (6x8mm)
TSOP48

Y
2M x 16
TFBGA48
W19B320B
32M
3.3V
Single Bank
4M x 8
  • Manufactured on WinStack-S 0.13um process technology
  • Operating Voltage: 3.0V (2.7V-3.6V)
  • Organization: 4Mbx8 / 2Mbx16
  • Speed: 70ns
  • Single bank
  • Boot Block: Top / Bottom
  • Secured Silicon Sector (256 Byte)
TSOP48

Y
2M x 16
TFBGA48