News & Events
December 18, 2002	Winbond America Introduces New Single Channel Voice CODEC Chip Featuring Enhanced Performance, Better Sound
November 12, 2002	Winbond America Hires Industry Veteran Peter Himes To Lead Its Marketing Team
October 22, 2002	Winbond Electronics Corporation America Hires Industry Veteran Larry Harris as Director of Engineering for Austin, Texas Design Facility
August 14, 2002	Winbond Introduces Industry`s First Non-Volatile Potentiometer Chip Featuring Selectable Output Buffer
July 25, 2002	Winbond Electronics Rolls Out W925 Series Chips Aimed at SMS Applications.
July 08, 2002	Winbond`s Introduces New Single Channel Voice CODEC Chip
January 22, 2002	Winbond Offers Text-To-Speech Customers New Reference Design
December 04, 2001	Winbond Electronics Corporation America Achieves QS-9000 Certification
November 28, 2001	Winbond Introduces New Microcontroller Solution with EEPROM/PWM/Flash.
November 01, 2001	Winbond Launches Industry’s First Single-Chip Text-To-Speech Solution
October 01, 2001	Winbond Launches Company`s First ACPI Power Control IC
September 26, 2001	Winbond Launches Industry`s First Hardware Monitor IC Featuring Speech Function and ASF Specification Compliance
September 24, 2001	Winbond Introduces Non-Volatile Memory Products and Modules To The U. S. market
September 17, 2001	Winbond Launches New Series of SMART@IO Controller ICs Featuring Reader and Interface Support for Three Major Memory Card Standards and SMART Card
September 10, 2001	Winbond Milestones For The First Half of 2001
August 16, 2001	Winbond Electronics Corporation Introduces New Chipcorder Voice Solution IC with Integrated Audio CODEC