Winbond Introduces New Voice CODEC / RSLIC Chipset
For Next Generation Voice Applications

San Jose, CA, August 11, 2004 - Winbond Electronics Corporation America, a leading supplier of semiconductor solutions, today introduced two families of Ringing Subscriber Line Interface Circuits (RSLICs) the W671300 series and the W671500 series. These RSLICs are designed to work together with Winbond’s existing A-Law/µ-Law CODEC portfolio of devices to terminate analog POTS lines. Together the CODEC/RSLIC chipset provides a cost-effective solution supporting the complete BORSCHT feature requirements for short and medium loop length systems. This makes the chipset ideal for emerging customer premises equipment applications such as VoIP gateways, VoIP enabled DSL or Cable Modems as well as Analog Telephone Adapters.

The RSLIC family can operate in both 5V (W671500 Series) and 3.3V (W671300 Series) environments. Each family supports several product grades offering customers the flexibility to match performance to individual system requirements. Each device, for example, supports on-chip ringing, ranging from 100V in the high performance devices down to 75V in the most cost-sensitive solutions.

Similarly, Winbond's voice CODEC portfolio offers a range of devices operating at 5V and 3V in both single and dual channel architectures. Again feature variation across the portfolio offers customers design flexibility. Furthermore both CODEC and RSLIC devices are distinguished by low power consumption, particularly in the power down and standby modes, which are the most critical in battery backup designs.

"The first wave of VoIP deployment will be in network adapters capable of supporting the user's existing phones," said Peter Himes, Vice President of Marketing. "Winbond's CODEC-RSLIC solutions provide cost-effective solutions for this new market requirement."

The RSLICs are currently sampling, with volume production slated for next month. They are offered in PLCC and small footprint QFN package options. The voice CODECs are already in production, with package options of PDIP, SOP, SSOP and TSSOP available. A low-cost CODEC/RSLIC chipset evaluation system is also available.

About Winbond

Winbond Electronics Corporation America, based in San Jose, California, is a wholly-owned subsidiary of Winbond Electronics Corporation, the largest branded IC Company in Taiwan and a leading supplier of semiconductor solutions worldwide. Winbond America designs, develops, markets and sells IC solutions to the global electronics marketplace. With a strong emphasis on mixed-signal solutions, Winbond America’s primary mission is to serve the signal conditioning needs of computer, consumer and communications electronic manufacturers. Winbond Electronics Corporation has approximately 3,800 employees worldwide with design centers in Hsinchu, Taiwan; Shanghai, China; San Jose and Torrance, California; and Austin, Texas. The Company can be contacted via the web at http://winbond-usa.com for Winbond America, or through the corporate homepage at http://www.winbond.com..

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Note: Winbond is registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.