Winbond Introduces New Single-Channel 3V CODEC Chip
For Mobile Voice Applications

San Jose, CA, Dec. 15, 2003 — Winbond Electronics Corporation America, a leading supplier of semiconductor solutions, today introduced the W681310, a new Voiceband CODEC chip aimed at a wide variety of mobile voice applications. The W681310 is part of a growing family of voice CODEC chip solutions that Winbond offers and the eighth in the series rolled out this year. The chip is currently sampling and is competitively priced at under $0.98 in 25,000 quantities. For evaluation, the W681310ES, is offered at a cost of $15. For prototyping purposes, a development kit, the W681310DK, is also available. The development kit, priced at $120, provides system designers with a flexible, low cost method for developing and testing an application on a single, standalone platform.

The W681310 is a single-channel voice CODEC for analog-to-digital and digital-to-analog conversion. The chip includes complete µ-law and A-Law companders (pin selectable) that are designed to comply with industry specifications ITU-T G.711 and ITU-T G.712. The 3V IC features low power consumption, enables system level customization, and is offered in SOP and SSOP packaging.

“The 3V single-channel CODEC is ideal for a wide variety of low-power applications,” said Peter Himes, vice president, marketing, Winbond America. “Examples include Bluetooth handsets, VoIP, digital telephone, communication systems, and digital voice recorders. In addition, the chip is compatible with the Motorola® MC145481, making it a cost-effective alternative to current solutions available on the market.”

About Winbond

Winbond Electronics Corporation was founded in 1987 and is based in Hsinchu Science-Based Park, Taiwan. It has since become the largest branded IC Company in Taiwan, offering a broad range of PC and peripheral-related ICs, consumer electronics ICs, multimedia ICs, and memory ICs. Winbond is a market leader in the telephone dialer, PC I/O controller, memory, speech synthesizer and MPEG decoder markets. With three wafer fabs currently in operation, the Company utilizes process technologies ranging from 1.0µm down to 0.13µm. Winbond has approximately 4,000 employees worldwide with design centers located in Hsinchu, Taiwan; Shanghai, China; San Jose, California; and Austin, Texas. World Wide Web WECA home page: http://www.winbond-usa.com; World Wide Web corporate home page: http://www.winbond.com.

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Note: Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks mentioned herein are the property of their respective owners.