Winbond Introduces New Telephone Answering IC Solution Aimed At
Cordless Digital Phones

Cost-Effective Chipset Solution for TAD Requires No External Flash Memory

San Jose, CA, Dec. 10, 2003 — Winbond Electronics Corporation America, a leading supplier of semiconductor solutions, today introduced W9316 and W9352X, a new telephone answering chipset solution for DECT/WDCT applications. The W9316, a fully integrated chip utilizes Winbond’s proprietary Multi-Level Flash technology for the voice storage — which doesn’t require costly external Flash memory — and is easily implemented into existing telephone answering machines with different platforms. Together, with the noise suppression feature from the baseband chip (W9352X), designers can easily design-in high voice quality and low cost telephone answering functions into cordless phones.

In the majority of western countries, 80 percent of families currently have telephone answering machines. Modern telephone answering machines employ external Flash memory as the storage media, rather than traditional cassette tapes. Due to the high demand for Flash memory in cellular phones, the price of Flash memory has risen significantly while a supply shortage persists. Winbond’s new telephone answering solution enables customers to avoid the high cost and shortage issues associated with the use of external Flash memory. Currently, a reference design, including software and hardware, has been completed. In addition, several key customers have already implemented this solution into their designs.

About Winbond

Winbond Electronics Corporation was founded in 1987 and is based in Hsinchu Science-Based Park, Taiwan. It has since become the largest branded IC Company in Taiwan, offering a broad range of PC and peripheral-related ICs, consumer electronics ICs, multimedia ICs, and memory ICs. Winbond is a market leader in the telephone dialer, PC I/O controller, memory, speech synthesizer and MPEG decoder markets. With three wafer fabs currently in operation, the Company utilizes process technologies ranging from 1.0µm down to 0.13µm. Winbond has approximately 4,000 employees worldwide with design centers located in Hsinchu, Taiwan; Shanghai, China; San Jose, California; and Austin, Texas. World Wide Web WECA home page: http://www.winbond-usa.com; World Wide Web corporate home page: http://www.winbond.com.

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Note: Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks mentioned herein are the property of their respective owners.