Cypress Teams
With Winbond To Introduce Demonstration Kit
For 2.4-GHz Wireless VoIP Headset With
Best-In-Class Range And Performance
Kit Pairs Cypress’s Robust WirelessUSB™
LP Radio System-on-Chip
With the Winbond Single-Channel W681360 CODEC
SAN JOSE, Calif., November 11, 2006 – Cypress Semiconductor Corp. (NYSE: CY) today introduced
a demonstration kit for a Voice over Internet Protocol (VoIP)
headset. The new CY4638 VoIP Demonstration Kit pairs the best-in-class
interference immunity of Cypress’s low-power WirelessUSB™
LP (CYRF6936) 2.4-GHz radio system-on-chip with the clean
signal delivery of Winbond Electronics Corporation’s W681360 CODEC to provide an easily replicated, fast time-to-market
design. The robust solution results in fewer interruptions
than headsets using competing wireless technologies, and offers
a range over 20-meters.
The WirelessUSB LP headset board includes
a Cypress Wireless enCoRe II flash microcontroller, a low
power Winbond CODEC, and a rechargeable battery with the radio
module. Winbond’s W681360 single-channel voice CODEC is a 13-bit linear analog-to-digital
and digital-to-analog converter. The W681360 offers high performance voice quality at the lowest power
consumption in the industry, directly impacting talk-time
and battery life.
“A primary concern of VoIP headset
manufacturers is dropping packets due to interference, making
the extremely robust WirelessUSB LP solution a natural fit
to deliver an uninterrupted flow of data,” said Matt
Branda, senior strategic marketing manager for Wireless Products
at Cypress. “Not only does the interference immunity
of our WirelessUSB protocol outperform other 2.4-GHz solutions,
its robust operation outdoes more expensive Bluetooth and
DECT solutions as well. When you add in the excellent signal
quality of the Winbond Codec, the CY4638 VoIP Demonstration
Kit provides the groundwork for a winning VoIP headset.”
“Combining the W681360 CODEC with Cypress’s WirelessUSB LP is a great match,”
said Frank Dowling, Director of Product Marketing at Winbond.
“The low power consumption, excellent range, robustness
and cost effectiveness our technologies bring to the CY4638
kit are a perfect fit for the VoIP headset market.”
The CY4638 VoIP Headset Development Kit includes all of
the following items:
-
WirelessUSB LP Headset Board –
Innovative dual antenna design for robustness. Uses Cypress
WirelessUSB LP (CYRF6936), Wireless enCoRe II (CY7C60323)
flash MCU and Winbond ( W681360)
3V Single-Channel CODEC.
-
WirelessUSB LP Bridge – Simple,
small form-factor bridge. Uses WirelessUSB LP (CYRF6936)
and enCoRe III (CY7C64215) USB flash MCU.
-
WirelessUSB LP Demo Kit CD-ROM –
Provides hardware schematics, bill of materials and firmware
for Wireless VoIP headset design.
About WirelessUSB LP
Cypress’s WirelessUSB LP offers an
unparalleled feature set to enable superior interference immunity,
low bill-of-materials (BOM) costs, higher data rate applications,
and faster time-to-market for keyboards, mice, gaming devices,
presenter tools, and remotes, as well as other simple, multi-point-to-point
wireless applications. Featuring a highly integrated radio
transceiver plus digital baseband on a single chip, it operates
between 1.8 and 3.6 volts, using advanced power-saving techniques
to extend battery life in devices such as wireless mice. WirelessUSB
LP uses Cypress’s patented frequency agile Direct Sequence
Spread Spectrum (DSSS) technology to offer best-in-class interference
immunity for a 2.4-GHz radio system. This combination of low
power consumption, interference immunity and low cost make
it ideal for wireless HID applications.
Availability
The WirelessUSB LP VoIP demonstration board
is currently available and is priced at $249. For more information
please refer to the Developer Kits link on www.cypress.com,
or to purchase, click on the Online Store link or contact
licensed Cypress distributors. A photo of the demonstration
board is available at www.cypress.com/WirelessUSBLP-VoIP-headset-photo.
About Winbond
Winbond Electronics Corporation America,
based in San Jose, California, is a wholly-owned subsidiary
of Winbond Electronics Corporation, the largest branded IC
Company in Taiwan and a leading supplier of semiconductor
solutions worldwide. Winbond America designs, develops, markets
and sells IC solutions to the global electronics marketplace.
With a strong emphasis on mixed-signal solutions, Winbond
America’s primary mission is to serve the signal conditioning
needs of computer, consumer and communications electronic
manufacturers. Winbond Electronics Corporation has over 5,000 employees worldwide with design centers in Hsinchu,
Taiwan; Shanghai, China; San Jose and Torrance, California;
and Austin, Texas. For additional corporate or product information,
please visit our website at www.winbond-usa.com for Winbond America, or through the corporate homepage at www.winbond.com.
About Cypress
Cypress solutions perform: consumer, computation,
data communications, automotive, industrial, and solar. Leveraging
proprietary silicon processes, Cypress's product portfolio
includes a broad selection of wired and wireless USB devices,
CMOS image sensors, timing solutions, specialty memories,
high-bandwidth synchronous and micropower memory products,
optical solutions and reconfigurable mixed-signal arrays.
Cypress trades on the NYSE under the ticker symbol CY. Visit
us at www.cypress.com.
# # #
Cypress and the
Cypress logo are registered trademarks and WirelessUSB and
enCoRe are trademarks of Cypress Semiconductor Corporation.
Winbond is a registered trademark of Winbond Electronics Corporation.
All other trademarks are the property of their respective
owners.
Cypress Marketing Contact:
Samer Bahou
Cypress Public Relations
(408) 544-1081
OBS@cypress.com
Winbond Marketing Contact:
Velyn Sia
Marketing Operations Manager Winbond Electronics Corporation
America
408-474-1622
info@winbond.com
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