Winbond Electronics Corporation, a leading supplier in the I/O controller chip market, announces its next generation Super I/O controller: the W83667HG. Following the success of the W83627EHG and W83627DHG family of devices which have been highly regarded and widely adopted by the major motherboard and desktop PC manufacturers worldwide, Winbond presents the W83667HG.

The device implements the latest Intel® PECI (Platform Environment Control Interface) host and SST (Simple Serial Transport) client interfaces, and AMD® SB-TSI interface. Intel® PECI and AMD® SB-TSI interfaces are used to detect CPU thermal condition. The independent VID input / output pins, targeting performance and gaming segments, are used to execute CPU over-voltage setting dynamically, which will improve the CPU performance. Full function CIR (consumer Infrared), including receiver, learning, and emitting functions, is supported by the device, and can be used for remote control applications, such as Microsoft® Vista OS for Home Media Center. The device also provides SPI (serial peripheral interface) flash interface, so that the south bridge can communicate with the SPI flash through the LPC interface, and this adds the design flexibility. The highly integrated and feature-rich W83667HG is ideally suited for the coming Intel® Eaglelake platform and AMD® AM3 platform designs.

In addition to the new features described above, W83667HG supports legacy I/O controller functionalities as well, including interfaces for keyboard & mouse, UART, parallel printer, floppy disk drive, and GPIO. The device also performs system wake-up function from “S3” and “S5” ACPI states by keyboard, mouse or GPIO events. Meanwhile, Winbond has enhanced the performance of system hardware monitoring functions through advanced IC research and design. The device’s dual current-source architecture provides improved temperature measurement accuracy. The fan speed control circuit is suitable for either DC- or PWM-fan. Winbond patented SMART FAN™ closed-loop fan speed control algorithms are also included. By monitoring temperature, voltage, fan speed (RPM) and controlling fan speed (PWM), the W83667HG ensures efficiency and reliability of motherboard and desktop PC applications.

W83667HG feature set is most desirable for motherboard and desktop PC applications. For years, Winbond Electronics Corporation (WEC) has devoted to the development of creative IC components for motherboards, desktop PCs, notebook PCs and servers. Winbond will continue to invest in the development of cost effective ICs with the latest features and the best performance.

About Winbond
Winbond Electronics Corp. was founded in 1987 in Hsinchu Science Park, Taiwan. The company owns the capabilities of both IC design and manufacturing and provides entire solutions to the customers. Winbond focuses on the development of four main product lines, including µC& µC-based Consumer IC, Computer Logic IC, Mobile RAM, and Flash Memory, and it has built a solid foundation and a strong reputation in the semiconductor industry.

Winbond has five business groups, including Consumer IC Business Group, Computer Logic IC Business Group, DRAM Product Business Group, Flash Memory IC Business Group, and Memory IC Manufacturing Business Group. Each business group operates as a profit center to strengthen the company's operation model and keep the maneuverability and flexibility of the organization to adapt to the ever-changing semiconductor industry.

Winbond operates one 150mm wafer fab and one 300mm wafer fab. Winbond owns more than 2,500 patents worldwide and has subsidiaries in the USA, China, Israel, and Japan.

For more information, please visit: http://www.winbond.com

Note: Winbond is registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.