San Jose , CA , April 15, 2008 — Winbond Electronics Corporation today introduced ISD15000, the world's first single-chip, multi-message, digital ChipCorder ® series targeted for the automotive, industrial and telecommunications markets. The ISD15000 provide audio grade record/playback, digital compression, integrated analog/digital audio signal paths, built-in, comprehensive memory management including macro scripts, I2S digital audio interface, faster digital recording and higher sampling frequency. These features are especially ideal for designers looking for an easy, cost effective and efficient way of supporting multi-language applications.

Winbond is known for introducing the highly commended W79E8213 integrated single chip system. Now, new versions of the 8-bit controllers, the W79E8213, will be making their debut. W79E8213 feature the Winbond 8051 core, which is capable of executing a single command in 4 clock cycles. It has a built-in 4K flash memory and is highly integrated with peripheral functions (e.g. 10-bit ADC, Buzzer, PWM, and internal restoration). The key features include fast execution, high noise immunity, and stability. They are all suitable for common embedded applications that require high performance in small packages.

The product's design calls for a small package that contains sufficient I/O and memory capacity for the desired application. Unique solutions can be used with this series of products such as power controller, motor controller, air conditioner, and treadmill machines.

The W79E8213 provides a complete hardware has programmer and backup file. The total package will assist the designer to quickly complete the development cycle and reduce the time-to-market. By using the ICP (In Circuit Program) functions can be used to directly program and update the system while it is still online. Product flexibility and expandability can be expected.

Winbond strives for the growth and satisfaction of our clients. Winbond will continue to expand the small package MCU product line and will provide various gradients of prices and optional features. In the current competitive market of consumer electronics and industrial controllers, this allows price attractive embedded applications to be possible.

The complete series of Winbond small package chips are presently available for clients to sample and order placements.

	Flash	RAM	Data memory	I/O	Timer	Serial I/O	PWM	ADC	Operating Freq.	Operating Temp.	Package
W79E8213	4K	128B	128B-	15	2*16bit	-	4*10bit	8*10bit	4~20MHz	-40~85 ?	SOP-20
W79E834	8K	512B	-	23	3*16bit	UART & SPI	4*10bit	8*10bit	4~20MHz	-40~85 ?	SOP-28.LQFP48
W79E833	4K	256B	-	23	3*16bit	UART & SPI	4*10bit	4*10bit	4~20MHz	-40~85 ?	SOP-28
W79E832	2K	256B	-	23	3*16bit	UART & SPI	4*10bit	4*10bit	4~20MHz	-40~85 ?	SOP-28
W79E825	16K	256B	256B	15	2*16bit	UART & I2C	4*10bit	4*10bit	4~20MHz	-40~85 ?	DIP/SOP-20
W79E824	8K	256B	256B	15	2*16bit	UART & I2C	4*10bit	4*10bit	4~20MHz	-40~85 ?	DIP/SOP-20
W79E823	4K	128B	128B	15	2*16bit	UART & I2C	4*10bit	4*10bit	4~20MHz	-40~85 ?	DIP/SOP-20
W79E822	2K	128B	128B	15	2*16bit	UART & I2C	4*10bit	4*10bit	4~20MHz	-40~85 ?	DIP/SOP-20
W79E804	8K	256B	256B	15	2*16bit	UART & I2C	4*10bit	-	4~20MHz	-40~85 ?	DIP/SOP-20
W79E803	4K	256B	256B	15	2*16bit	UART & I2C	4*10bit	-	4~20MHz	-40~85 ?	DIP/SOP-20
W79E802	2K	256B	256B	15	2*16bit	UART & I2C	4*10bit	-	4~20MHz	-40~85 ?	DIP/SOP-20

About Winbond
Winbond Electronics Corp. was founded in 1987 in Hsinchu Science Park, Taiwan. The company owns the capabilities of both IC design and manufacturing and provides entire solutions to the customers. Winbond focuses on the development of four main product lines, including µC & µC-based Consumer IC, Computer Logic IC, Mobile RAM, and Flash Memory, and it has built a solid foundation and a strong reputation in the semiconductor industry.

Winbond has five business groups, including Consumer IC Business Group, Computer Logic IC Business Group, DRAM Product Business Group, Flash Memory IC Business Group, and Memory IC Manufacturing Business Group. Each business group operates as a profit center to strengthen the company's operation model and keep the maneuverability and flexibility of the organization to adapt to the ever-changing semiconductor industry.

Winbond operates one 150mm wafer fab and one 300mm wafer fab. Winbond owns more than 2,500 patents worldwide and has subsidiaries in the USA, China, Israel, and Japan.

For more information, please visit: http://www.winbond.com

Note: Winbond is registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.