Winbond Electronics Corporation is introducing a new, high precision, energy saving hardware monitoring IC series - W83L771AWG/773G/775G. These devices support advanced feature such as user programmable conversion rates for OEM optimized designs and low power standby mode to minimize the power consumption of notebook PCs, desktop PCs and servers. The W83L77x series products feature an on-die temperature sensor as standard. The W83L771AWG supports one remote temperature sensor (one local / one remote). The W83L773G and the W83775G support two remote temperature sensors (one local and two remote). The relevant temperature values from these sensors typically form the basis of system health management.

In addition to temperature monitoring, the W83L771AWG/775G devices allows users to set critical temperature limits. When the monitored temperature exceeds the limits, the devices will alert the user. Users can activate out-of-range temperature protection mechanisms as required, including shutting down the system to avoid possible damage. Noise filters are included for the remote temperature sensing channel to minimize noise interference on temperature measurement. The system interface of these devices is I2C bus. The W83L771AWG is available in both 8-pin TSSOP and SOP packages, the W83L773G is available in 8-pin TSSOP package and the W83L775G is available in 10-pin TSSOP package.

The W83L771AWG/773G/775G series is Winbond’s latest offer of high precision and low power consumption hardware monitoring ICs. Winbond is continuing the strategy of broadening the product portfolio and enhancing technologies to provide comprehensive hardware monitoring IC solutions to the market.

About Winbond
Winbond Electronics Corp. was founded in 1987 in Hsinchu Science Park, Taiwan. The company owns the capabilities of both IC design and manufacturing and provides entire solutions to the customers. Winbond focuses on the development of four main product lines, including µC & µC-based Consumer IC, Computer Logic IC, Mobile RAM, and Flash Memory, and it has built a solid foundation and a strong reputation in the semiconductor industry.

Winbond has five business groups, including Consumer IC Business Group, Computer Logic IC Business Group, DRAM Product Business Group, Flash Memory IC Business Group, and Memory IC Manufacturing Business Group. Each business group operates as a profit center to strengthen the company’s operation model and keep the maneuverability and flexibility of the organization to adapt to the ever-changing semiconductor industry.

Winbond has over 4,000 employees worldwide and operates one 150mm wafer fab and one 300mm wafer fab. Winbond owns more than 2,500 patents worldwide and has subsidiaries in the USA, China, Israel, and Japan. For more information, please visit: http://www.winbond.com

Note: Winbond is registered trademarks of Winbond Electronics Corp.. All other trademarks and copyrights mentioned herein are the property of their respective owners.