SAN JOSE, Calif., USA—At 2008 IIC-China Shenzhen(Mar.3-4) & Shanghai(Mar.10-11), Winbond Electronics Corp. introduces reference designs and solutions based on new highly integrated USB audio controllers for the fastest growing area of the USB VoIP telephony and PC audio peripheral market. The W681308 reference design solutions can be designed in all application segments of Skype™, PC VoIP and USB audio peripherals to substantially speeds design time and time-to-market, increases system reliability and significantly lowers system cost.

The W681308 reference designs include following solutions:
1. USB VoIP phone hardware/software to support SIP and Skype IM applications.
2. USB VoIP phone with optical mouse to support SIP and Skype IM applications.
3. USB VoIP memory phone with optional Nand flash memory to support SIP and Skype IM applications.
4. USB audio peripherals that includes USB microphone and USB L/R mono VoIP speakers to support audio playback and VoIP applications.

In addition to above reference designs base on Winbond’s USB audio product, W681308 is the latest addition to Winbond's growing family of USB Audio Controllers. With full function integration that quickens design time, the W681308 provides a single-chip, one-stop solution for a spectrum of Skype or other PC-based VoIP and audio applications from wired and wireless USB handsets, to USB speaker phones, to PSTN/USB dual mode phones, to USB PSTN gateways and USB Analog Telephone Adapters (ATAs) to the wireless USB 2.4Ghz base / handset. Winbond’s new higher-integration part can replace 3 to 4 devices and offers the lowest BOM costs for PC-based VoIP applications. Its 16-bit ADC/DAC with 8/16/48-kHz wide-band sampling rate results in the best voice quality in a VoIP environment.

Winbond's W681308 chip is USB2.0 full speed compatible and integrates a fast 8051 MCU that enables feature rich applications. The part also has a 8/16/48-kHz sampling rate wideband Codec with a 16-bit ADC/DAC and Acoustic Echo cancellation (AEC) and AGC to support USB speaker phone applications. This single-chip solution also supports full-duplex echo cancellation, 3-channel PCM mixer, integrated microphone amplifier and speaker driver, flexible OTP custom programming and complete reference design solutions. The high integration of the W681308 enables lower cost and smaller board space design.

"Winbond's market commitment is to provide a complete line of USB Audio and PC-based VoIP solutions. With this new product for USB VoIP applications, we are enabling customers to easily and quickly build a full line of USB VoIP and Audio products" said Ike Saeed, Vice President of Marketing Mixed Signal Product Center, Winbond Electronics Corporation America.

This device joins the Winbond USB Audio Controller Series (W681306, W681307 and W681308) which provides a complete line of USB VoIP and audio solutions for customers with the shortest time-to-market requirements.

A complete Software Development Kit (SDK) and 8051-based Keil C development system for these parts is available. The W681308 is in a 48-pin LQFP lead-free package. W681306 and W681307 are both in 100-pin LQFP lead-free packages. W681308 pricing is being quoted as $1.80 at 10k quantity. Additional product information for USB Audio Controllers is available at http://www.winbond.com. Samples are available now from local Winbond sales offices and its authorized representatives.

About Winbond
Winbond Electronics Corp. was founded in 1987 in Hsinchu Science Park, Taiwan. The company owns the capabilities of both IC design and manufacturing and provides entire solutions to the customers. Winbond focuses on the development of four main product lines, including µC & µC-based Consumer IC, Computer Logic IC, Mobile RAM, and Flash Memory, and it has built a solid foundation and a strong reputation in the semiconductor industry.

Winbond has five business groups, including Consumer IC Business Group, Computer Logic IC Business Group, DRAM Product Business Group, Flash Memory IC Business Group, and Memory IC Manufacturing Business Group. Each business group operates as a profit center to strengthen the company’s operation model and keep the maneuverability and flexibility of the organization to adapt to the ever-changing semiconductor industry.

Winbond has over 4,000 employees worldwide and operates one 150mm wafer fab and one 300mm wafer fab. Winbond owns more than 2,500 patents worldwide and has subsidiaries in the USA, China, Israel, and Japan. For more information, please visit: http://www.winbond.com

Note: Winbond is registered trademarks of Winbond Electronics Corp.. All other trademarks and copyrights mentioned herein are the property of their respective owners.